Contact Us:
SensL USA
Mountain View, CA
Tel: +1 650 210 9110
SensL Ireland
Blackrock, Cork
Tel: +353 21 435 0442
Our Capabilities
A significant advantage that SensL provides is access to full fabrication facilities and all devices parameters can be modified and varied as per customer requirements in an extremely fast turn-around time.
SensL provides fully customisable fabrication facilities to allow rapid prototyping of advanced devices. The facilities include a full CMOS process for prototype and manufacturing of devices and proven ability to migrate advanced technology to higher production fabrication facilities when required. SensL provide a full testing laboratory for all wafer and packaged level testing, femto amp current (I-V), capacitance voltage (C-V), dark count, and response rate. Lifetime testing, reliability and stress testing can also be arranged in-house as required.
Total Flexibility
SensL customise its technology and design photon counting sensors to customer specifications. This is simply not possible in larger more established competitors, many of whom depend on outsourcing their fabrication requirements to general purpose I.C. foundry facilities.
Simulation & Modeling
SensL has the capability and resources to work with customers to model optical application/problems and to work with them to optimize the solution, in terms of the light source, detector and optical path (lens, filters etc). SensL�s modeling and simulation capabilities include CMOS design (to optimise the silicon structures and design), SPICE (to optimise the electrical performance of the device and circuits), optical path design (to optimise the lens, filter and optical losses of a particular setup), and a number of proprietary numerical modeling packages for device optimisation. Please contact us for details.
Sensor combined with Light Source
All fluorescence based applications require a light source to initiate the fluorescence as well as the detectors. SensL has a unique patent that enables the integration of VCSEL, photon counting detector (including small arrays) and filters on a single silicon package. This is ideal for applications where miniaturisation is required. Through our association with a specialist VCSEL company we have access to a range of VCSELs and RCLEDs at wavelengths not generally available on the open market.
Miniature Microsystems
Through SensL�s association with the Tyndall National Institute we have access to a range of packaging and miniaturisation capabilities. Please contact us for details and information.
Micro Optics
Through SensL�s association with other advanced technology companies we can offer wafer level customised optics on our sensors.
Sensor combined with Micro fluidics
SensL offer integration of light sources, sensors, optical fibres, micro fluidics and micro-capillary tubes on integrated optical bench or micro fluidic platforms.
Some examples include:
Flip chipping of sensors directly over micro fluidic channel